RAISE+@HKU (Research, Academic and Industry Sectors One-plus) Scheme under the Innovation and Technology Fund (ITF) aims to support designated universities and their research teams in transforming and commercializing research and development (R&D) outcomes into successful startups within five years.

The scheme consists of two stages:

  1. the transformation and realization of R&D outcomes in three years, and
  2. the initiation of commercialization within the remaining project period.

Application Procedure (HKU Internal Stage)

1. Call for application of the RAISe+ to HKU for review will be made through email.

2. The deadline of application for HKU Internal Stage review shall be 25th March 2024 at 12 noon (Hong Kong Time).

3. The applicant should submit the following required documents:-

  1. The one-page HKU RAISe+ application form;
  2. Industry commitment letter;(2)
  3. The structure of all organisations making industry contribution for matching purpose (the information should include: ownership, governance, hierarchy and relationships, names of shareholders, names of investors, etc.);
  4. Copy of Certificate of Incorporation (if applying as a start-up);
  5. A pitching deck with no more than 12 slides providing information pertaining to the respective aspects of the assessment mentioned in Annex A;
  6. Copies of IP licensing agreements (if any)

electronically to HKU TTO ( on or before the deadline. All sections of the application form must be duly completed; otherwise the application will not be assessed.

Important documents for Cohort 2: (Requires HKU Email Login)

  1. Submission Guideline for RAISe+ Scheme for HKU Review
  2. HKU RAISe+ application form

Closing date / Application deadline: 25th March 2024 (Monday) 12:00 nn (Hong Kong Time)

Related resources

ITF RAISe+ Information Page

HKU Technology Startup Guide / Inventor's Guide

Conflict of Interest (COI) policy and Outside Practice Regulations of HKU (Staff Handbook)

HKU Invention Disclosure (Patent)

HKU Invention Disclosure (Software / Copyright)


Please send your questions to

Technology Transfer Office
The University of Hong Kong